Between thermal throttling and failing stress tests, cramming the fastest processors into slim foldable phones is a recipe ...

Valve's decision to ship its latest Steam Machine with a single memory module is drawing closer scrutiny as early testing ...

The Magic V6 is now available and even thinner than last years model, yet it has a larger battery capacity. We take it for a ...

Samsung’s upcoming Exynos 2700 processor is getting a complete structural redesign focused heavily on thermal management. According to supply chain rumors, the new layout will physically separate the ...

Solving complex optimization problems is central to many modern technologies, from logistics and financial modeling to chip ...

In a Telegram post, leaker Mystic Leaks claims Google is preparing a major Linux kernel upgrade for its recent Pixel phones.

AMD Zen 6 Linux kernel patches reveal a new Low Power core designed to improve efficiency for future Medusa processors and ...

Making chips smaller has dominated the semiconductor conversation for years, but TSMC’s next big leap may come from how those chips are packaged instead. According to analyst Ming-Chi Kuo, the company ...

AMSTERDAM, May 28 (Reuters) - A senior TSMC (2330.TW), opens new tab executive said on Thursday that surging electricity ‌demands from AI are making energy efficiency rather than computing power the ...

The frenzied rally in chip stocks passed a new milestone on Wednesday, with the PHLX Semiconductor Index posting its strongest performance through the first 100 trading days of any year on record.

The plot thickens in the great AI chip race. Tingbo He, president of Huawei’s chip-design subsidiary HiSilicon, says her company’s engineers have developed a novel way to optimize semiconductors—and ...

As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect, and ...