Micron says AI-driven memory chip shortage is 'unprecedented,' to last beyond 2026

Micron says the AI-driven memory-chip shortage is worsening and may last beyond 2026, boosting MU/NVDA supply chain focus.
Optics

Taiwan’s UMC to mass-produce imec's silicon photonics technology

United Microelectronics Corporation (UMC), the giant Taiwan-headquartered chip foundry, has signed a licensing deal to transfer and scale up production of devices using the “iSiPP300” silicon ...
Semiconductor Engineering

HBM Leads The Way To Defect-Free Bumps

High-bandwidth memory stands at the forefront of multiple technology developments as a critical enabler of AI, but it is one of the most difficult modules to manufacture. Leading HBM device makers and ...
Tom's Guide

TSMC's new 2nm chip will reportedly cost 50% more — get ready for more expensive laptops and phones

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Semiconductor Engineering

Glass Substrates Gain Momentum

As a package substrate, the benefits of glass are substantial. It’s extremely flat with lower thermal expansion than organic substrates, which simplifies lithography. And that’s just for starters.
Digi Times

PBA released their latest nano-precision dual gantry stage platform series for heterogeneous semiconductor advanced packaging and metrology equipment

The age of AI greatly boosts Semiconductor manufacturing demands in advanced packaging. As packaging complexity increases (more I/O, smaller bump pitches, higher density), making the integration of ...
IEEE

Flip-Chip Bonding Using Aerosol Jet Printed Silver Nanoparticles for RF Applications

Abstract: This work demonstrates a new approach to flip-chip bonding of RF chips using aerosol jet printed (AJP) silver nanoparticle (NP) microbumps for advanced packaging and heterogeneous ...