The fRAme approach grounds the evaluation in the theory of dispositions, which allows both human abilities and technological capacities to be described in comparable terms. By focusing on specific ...
The first day of the International Platform on Adaptation Metrics conference opened Monday morning with pointed questions about whether the world’s major climate and development frameworks are truly ...
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The architect and the scaffold: A collaborative pathway to South Africa’s National Entrepreneurship Strategy
The challenges of skills mismatches, pedagogical gaps, and a difficult operating environment are not insurmountable ...
An expert Q&A on the US Patent and Trademark Office’s (USPTO’s) 2025 guidance memoranda addressing the Patent Trial and Appeal Board’s (PTAB’s) approach to discretionary denials of inter partes review ...
Discover how the Fed's revised stress capital buffer for Morgan Stanley impacts its CET1 ratio and investor returns.
The UK’s recent commitment to Small Modular Reactors (SMRs) – backed by up to £20bn (US$26.5bn) through June’s government spending review – marks a pivotal and highly encouraging shift in national ...
Because Salesforce is a large SaaS investment, renewal time should be seen as a pivotal opportunity to realign your platform strategy with business priorities.
Tech Xplore on MSN
A new safety assessment framework for liquid hydrogen storage systems in unmanned aerial vehicles
Aviation accounts for approximately 12% of global carbon dioxide emissions. With intensifying climate change and environmental issues, the aviation industry is searching for greener propulsion systems ...
QuEra Computing, a neutral-atom quantum computing company, announced that Nature has published “Low-Overhead Transversal - Read more from Inside HPC & AI News.
Uniform and intensive forest management approaches threaten European forest biodiversity. There are many different ways to manage forests, but the effects of different combinations of approaches are ...
Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...
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