Researchers from University of Michigan-Dearborn published a technical paper titled “Generative Design of Liquid-Cooling ...

Researchers from Peking University, Chinese Academy of Sciences et al. published a technical paper titled “Homo-metal-element ...

AI is supposed to be the answer to this. But for many teams, the AI conversation stalls before it starts, because it gets ...

Can LLMs turn a specification into a set of formal properties that can be used to verify an implementation? The answer is ...

Advanced-node design to reduce iterations and improve correlation for DTCO-focused advanced AI and HPC designs.

Three new, economical, and scalable platforms, triggered by the convergence of AI-related hardware needs, new process ...

Many digital standards, like USB4 Version 2.0 (USB4v2), LPDDR6, and PCIe 6.0, are getting more complex and time-consuming to ...

Effective substrate implementation is crucial for signal integrity, power delivery, and overall system reliability.

Discover bugs that neither constrained-random simulation nor model-heavy equivalence flows are structurally capable of ...

Thinner dies, more TSV area, thermal dissipation, and limited manufacturing capacity make HBM scaling much more difficult.

I am a Swede, and I want my coffee strong and plentiful. In most places outside the Nordic countries, this means figuring out ...

The rapid build-out of AI on the edge marks a fundamental shift in where intelligence is located, how much is included in ...