To address the intense heat loads that limit the reliability of next-generation computers and ...

Carbon nanotubes (CNTs) have been used for everything from inks for printed electronics, to 3-D-printed metamaterial, to photovoltaic solar panels. They're also being used to create a novel thermal ...

Electronic devices produce more heat as they become more powerful. A new bacteria-based material could offer a better way to ...

As computers, electric vehicles, and other advanced electronic devices become more powerful, they also produce more heat. Too ...

With the increasing waste heat production by today’s electronics in ever smaller spaces, drawing this heat away quickly enough to prevent thermal throttling or damage is a major concern. This is where ...

How data center liquid cooling solutions and telecom cable compounds support reliable, scalable infrastructure as AI workloads grow.

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...

Thermal Interface Material (TIM) plays an important role in power electronics, computing processors, sensors, and energy storage devices. TIMs are the materials used to fill the void between heat ...

Thermal interface materials (TIMs) are composed of thermal fillers and matrix materials. Thermal fillers are highly thermally conductive substances, while matrix materials are typically used to ...

A new technical paper titled “TIMtrace: Coverage Path Planning for Thermal Interface Materials” was published by researchers at Karlsruhe Institute of Technology (KIT) and Robert Bosch GmbH. “Thermal ...

Next-generation electronic devices like newer computers and other high-power devices require more energy to run. When they are working hard, the intense heat they generate can limit their performance ...