Business Wire

Furukawa Electric Begins Mass Producing Stealth Dicing Tape

TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...
Mena FN

Wafer Dicing Services Market Set To Exceed US$ 932.9 Million By 2035 Astute Analytica

(MENAFN- GlobeNewsWire - Nasdaq) The market currently experiences rapid technological bifurcation where mechanical methods handle standard output while advanced laser solutions address the burgeoning ...
AZoNano

Increasing Wafer Yield with Semiconductor Wafer Stealth Dicing Methods by Intelligent Motion / Laser Control Algorithms and Motion Stages

Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...
Semiconductor Engineering

Plasma Dicing 101: The Basics

Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...