For decades, packaging design has been a painstaking process, with designers and brands having to juggle multiple complex tools to complete just a single project. The outcome has often been riddled ...

AI packaging tools provider Pacdora is preparing to introduce a comprehensive AI-powered solution for design and marketing to transform the packaging creation process. With more than six million users ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...

SINGAPORE, Aug. 29, 2025 /PRNewswire/ -- Today, Pacdora, a fast-growing packaging design platform, is looking ahead and sharing its vision for a fully AI-powered, end-to-end solution for design and ...

(MENAFN- PR Newswire) The tech company was launched in March 2022, and since then, it has developed from a startup to a globally recognized packaging design solution for businesses and designers.