Miniature smart sensor combines 3-axis digital accelerometer with embedded microcontroller, operating as sensor hub that runs sensor-fusion algorithms, together in ultra-compact package called iNEMO-A ...
Fig 1. Wafer-level BGA packaging and a patented heated-gas thermal acceleration measurement method combine to produce MEMSIC’s MXC626Xc two-axis digital accelerometer, which is small enough to be ...
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